I am a recent Mechanical grad with emphasis on addressing design and thermal concerns for electronics, actively looking for a full time opportunity as Mechanical/Thermal Engineer.
Experience
Mechanical Design Engineer Intern at UHV Technologies Inc: Successfully Built a scrap metal sorter by working on the design of frames, material handling devices, pneumatic & optic systems, sheet metal skins applying GD&T which sorts 3 metals with a capacity of 2000lbs/hr of separation, utilizing SolidWorks Coordinating with multi- disciplinary teams Generated BOM, Strong problem solving and critical thinking Skills
Design/Data Analyst at Acumen Aviation: Responsible for general airworthiness and repair inspection of aircraft, parts, avionics equipment per general safety standards and regulatory requirements. Reviewed vendor equipment drawings Also performed component design & structural analysis using SolidWorks and ANSYS.
Mechanical Engineer at Turbo Mega services & works Pvt Ltd: Project Management: Accomplished 3 projects with continuous improvement in engineering department and project planning with 80% probability of success Developed and documented equipment specifications Carried out the phase-wise budgeting for the entire project and saved 10% of the Project Budget. Created Master Program Plan and Integrated Master Plan to track the project progress.
Projects
Liquid cooling of Data centers: Developed a dynamic cold plate for Target delivery of coolant to data centers to remove hotspots, Designed and analyzed thermally using Ansys. Thermal & Fluid analysis of water, along with miniaturizing existing designs of Cold plates to increase Pumping efficiency, energy conservation and costing Analysis. Optimized different cold plates & Heatsinks using 6sigmaET for their best operational efficiency.
Product Development (Flow Control device): Design and Development of a Self-regulated passively operated flow control device using Bi-metallic strips. Conducted Flow and thermal measurements of materials and manufacturing processes along with calculation of its Response time Validated design modifications for thermal concerns using simulation and actual prototypes (3D printing). Integrated MATLAB with 6sigmaET for analytical/statistical analysis and automation of Flow control device in a Data center rack. Experimentally validated the developed control strategy showing 64% of pumping power savings.
Thermal Cycling of BGA Package: Developed a BGA Package in Ansys Icepack to Conduct Thermal cycling on PCB components to study how alternating extremities of heat signatures show effect on solder joints by using Electronic packaging principles.
Stress and strain Analysis on a Printer circuit board: Design and simulation of a PCB in Ansys to check Elastic stress & strain, Directional and total deformation to analyze it structurally.
Design and Simulation of a pipe to test pressure capabilities, maximum capacity, reliability, and joint fittings along with stress and strain analysis.
Design and Simulation of retaining ring and Compressor Reed valve to check Reliability factors.
Knowledge of Tolerance analysis, GD&T principles, & FEA simulation.