Being motivated by challenging and multi-faceted problems, I am working towards my doctoral degree aiming to provide better solutions for improving the thermo-mechanical reliability of data center electronics using computational and experimental techniques. As a Ph.D. student, I am leading a team to address the critical issue of corrosion of air-cooled data center hardware in harsh environments to promote cleaner and economic data center cooling technologies. As a project lead my responsibilities include giving monthly updates as presentations on project progress to industrial mentors, mentoring and helping masters students with their master’s research, and continuously publishing and presenting the research findings. I am a cross-functional team member on thermal management projects on efficient and novel data center cooling methodologies such as liquid and immersion cooling. I believe I am very versatile as a mechanical engineer, having worked in past on various mechanical design, thermal and finite element analysis projects, and internships. Apart from the computational skills I have hands-on experience working on designing experiments and performing data analysis in a lab environment for the past 2 years. As an individual, I am pro-active, a self-starter, easily adaptable to new environments and I am passionate as an engineer and someone who thrives in challenging environments where I can learn something new every day.
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Experience
Graduate Teaching Assistant, The University of Texas at Arlington (Jan 2019-Present)
• Managing 65+ sophomore students in Mechanical and Structural Behavior of Materials
• Responsible for course grading, coaching and assisting in course evaluation
Volunteer Research Assistant: EMNSPC Center Research Lab, UTA (Jun 2018-Dec 2018)
• Testing of contaminated PCB coupons (IPC-B25-A test board) under varying temperature and humidity conditions
• Responsible for current sensor setup using Arduino board
• Executed the calculation of Deliquescent Relative Humidity from the obtained current and voltage readings
• Accountable for data acquisition and preparing data analysis reports of results obtained from the environmental chamber
• Researched on Preventive Maintenance and Failure Frequencies of server components using Pareto Analysis and FMEA
Design Engineer Intern: AeroSphere, (Jun 2014-Jul 2014)
• Designed a 5-cylinder radial engine used in MOKI 400S aircraft in CATIA V5 R18 using component drawings
• Improved the strength to weight ratio of the master rod by optimizing the engine assembly using ANSYS Static Structural FEA
• Achieved an increased Factor of Safety of 4.8 on the piston and 1.003 on master rod under 4 MPa operating load
On-campus Research Engineer, AeroSphere (Aug 2014-May 2015)
• Lead a team of six students on a project on 3D modeling and FEA of a torque arm of an aircraft landing gear
• Designed multiple engineering components, metal parts, assemblies and brackets from detailed drawings in CATIA V5
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Projects
Data Center Contamination (Team Lead)
• Evaluating the impacts of gaseous and particulate contaminants on the reliability of data center hardware
• Testing PCB and PCB components for corrosion-induced failures using experimental and numerical methods
• Investigating particle transport and corrosion formation of airborne contaminants in a data center in ANSYS FLUENT
• Modeling corrosion rates in Hard Disks in harsh environments using species transport using CFD
Liquid and Dielectric Immersion Cooling
• Estimating thermal performance improvements in single-phase immersion cooling for natural and forced convection
• Determined thermo-mechanical reliability of PCB components in immersion cooling using accelerated thermal cycling
• Exploring improvement in heat transfer characteristics utilizing novel heat sink design and manufacturing methods with dielectric nanofluids
Electronic Packaging
Utilized ANSYS Icepak Macros to create a small scale raised floor data center and solved it for cooling airflow
Resolved the issue for overheating by reducing the thermal shadowing effect at the CPU
Reduced the die temperatures further by 20% by optimizing the heat sink design
Reduced the maximum junction temperature by; parameterizing the heat sink height, using a heat spreader and a mold compound
Analyzed solder joint fatigue life of a simplified BGA package using Accelerated Thermal Cycling extension in ANSYS
Identified thermal stresses, cycle to crack initiation, cycles to package failure and impact of CTE on solder joint reliability
Bird Strike Simulation on an aircraft wing
Designed a detailed model of a NACA 2412 wing containing front and rear spars, ribs, and stringers in CATIA V5R188
Statistically analyzed the wing structure in ANSYS 14.0 to simulate the impact of bird strike on the wing
The analysis showed no cracking in the wing skin but a total deformation of 3 cm, which is enough to ground the aircraft
Two Aluminum alloys (Al7075 and Al2024) were compared to determine the least deforming alloy
Total deformation analysis showed that Al7075 deformed lesser than Al2024 and was a better choice as wing skin material